LB Wi-Fi BGA Mounting Head BGA549

LB WiFi Head BGA549 — mounting module for precise positioning and fixation of Wi-Fi chips in BGA549 package during reballing and contact restoration.

Key specifications:

Support for BGA549 format chips.
Landing module size — 22 × 25 mm.
Precise centering and stable chip fixation.
Compatibility with Wi-Fi chips in select MacBook models based on Apple M1 and M2.

Purpose:

Reballing Wi-Fi BGA chips.
Contact pad restoration.
Chip preparation for reinstallation on logic board.

Country of manufacture — China. Condition — new. SKU — 101101.