YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone X / 11 Series

SKU107182117253
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
724,00 UAH
In stock: 5
European warehouse ships on Friday, 23 October
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Тип запчастини
Бренд
Сумісні моделі
Tool for iPhone 11 Pro Max →

Description

  • Tin mesh designed for precise reballing of iPhone 11 Pro, 11 Pro Max and XS Max logic board solder pads
  • Restores damaged or missing pad structures during IC replacement and multilayer board repair
  • Ensures accurate alignment and consistent solder distribution across rebuilt sections
  • Ideal for CPU, PMIC and mid-layer module reballing on the listed iPhone models
  • High-temperature resistant mesh suitable for professional microsoldering workflows
  • YCS mesh engineered for accuracy, durability and stable performance in board-level rework

Tool — replacement part for: iPhone 11 Pro Max. Condition — new. SKU — 107182117253.

Ще до iPhone 11 Pro Max

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