YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 14 Series

SKU107182117256
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
650,00 UAH
In stock: 6
European warehouse ships on Friday, 23 October
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Бренд
Apple
Сумісні моделі
iPhone 14 Pro Max

Description

  • Tin mesh designed for accurate reballing of iPhone 14 Pro and 14 Pro Max logic board solder pads
  • Ensures precise restoration of pad structures during middle-layer and IC rework
  • Improves alignment and consistency for CPU, PMIC and multilayer module repairs
  • High-temperature resistant mesh suitable for professional microsoldering work
  • Optimized for restoring missing or damaged solder points across internal board layers
  • YCS mesh engineered for stable, reliable performance in advanced board-level repair

Compatible models: iPhone 14 Pro Max. Condition — new. SKU — 107182117256.

Ще до iPhone 14 Pro Max

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