YCS Mid-layer General-purpose Tin Planting Platform For iPhone 17 Series

SKU107182117260
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
653,00 UAH
In stock: 13
European warehouse ships on Friday, 23 October
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Бренд
Apple
Сумісні моделі
iPhone 17

Description

  • Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards
  • Ensures precise restoration of solder points across middle layers during board-level repair
  • Improves alignment and consistency when rebuilding damaged or missing solder pads
  • Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards
  • High-temperature resistant mesh compatible with professional microsoldering workflows
  • YCS mesh optimized for reliability and accuracy in advanced logic board rework

Compatible models: iPhone 17. Condition — new. SKU — 107182117260.

Ще до iPhone 17

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