LB 2-in-1 Mounting Head for Wi-Fi BGA BGA183/BGA364 16×22 iPhone (XR/XS/XS Max)

LB 2-in-1 — mounting holder for precise positioning and fixation of Wi-Fi BGA chips during reballing and contact pad restoration.

Key specifications:

Support for BGA183 and BGA364 packages.
Working size — 16 × 22 mm.
Precise chip centering.
Reliable chip fixation during heating and solder application.
Compatibility with iPhone XR, iPhone XS and iPhone XS Max.

Purpose:

Reballing Wi-Fi BGA chips.
Contact restoration and chip preparation for installation.
Professional logic board repair

Country of manufacture — China. Condition — new. SKU — 101104.