YCS Mid-layer General-purpose Tin Planting Platform For iPhone 16 Series

SKU107182117258
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
650,00 ₴
In stock: 20
European warehouse ships the day after tomorrow
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Brand
Apple
Compatible models
iPhone 16

Description

  • Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards
  • Restores damaged or missing solder points across internal board layers
  • Ensures accurate alignment during reconstruction of middle-layer solder pads
  • Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series
  • High-temperature resistant mesh optimized for professional microsoldering environments
  • YCS mesh engineered for consistent accuracy in advanced board-level rework

Compatible models: iPhone 16. Condition — new. SKU — 107182117258.

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