YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 12 Series

SKU107182117255
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
673,00 ₴
In stock: 7
European warehouse ships the day after tomorrow
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Brand
Apple
Compatible models
iPhone 12 Pro Max

Description

  • Tin mesh designed for precise reballing of iPhone 12 Pro Max logic board solder pads
  • Restores damaged or missing pad structures during IC and multilayer board repair
  • Ensures accurate alignment and consistent solder distribution across reworked areas
  • Ideal for CPU, PMIC and mid-layer module reballing on the iPhone 12 Pro Max
  • High-temperature resistant mesh suitable for professional microsoldering workflows
  • YCS mesh engineered for reliability and accuracy in board-level rework

Compatible models: iPhone 12 Pro Max. Condition — new. SKU — 107182117255.

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