YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 13 Series

SKU107182117254
  • Nova Poshta shipping
  • Parts warranty
  • Exchange & return
733,00 ₴
In stock: 7
European warehouse ships the day after tomorrow
Estimated with you 30 October
Full prepayment only
Free shipping from 1000 ₴
Condition
New
Brand
Apple
Compatible models
iPhone 13 Pro Max

Description

  • Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads
  • Restores damaged or missing pad structures during multilayer and IC-level repair
  • Ensures accurate alignment and uniform solder distribution across reworked sections
  • Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max
  • High-temperature resistant mesh suitable for professional microsoldering tasks
  • YCS mesh engineered for consistency, accuracy and durability in board-level rework

Compatible models: iPhone 13 Pro Max. Condition — new. SKU — 107182117254.

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