LB Wi-Fi Chip BGA364, 16×22 mm / WiFi Chip BGA 364 16X22 (XS/XSM, iPad mini5/Pro 11 Gen 1/Pro 12.9 Gen 3)

LB BGA364 — Wi-Fi microchip designed to replace a faulty wireless communication chip on logic boards of compatible iPhone and iPad models. Used during component-level repair when the device fails to detect wireless networks, has unstable connection, or Wi-Fi function does not activate due to hardware failure.

The microchip is housed in a BGA364 package measuring 16 × 22 mm and is installed directly onto the logic board using BGA soldering.

Advantages

Conforms to BGA364 format.
Package size — 16 × 22 mm.
Designed to restore faulty Wi-Fi module.
Allows replacing individual chip without logic board replacement.
Suitable for professional component-level repair of Apple devices.

Compatibility
iPhone XS;
iPhone XS Max;
iPad mini 5;
iPad Pro 11″ 1st generation;
iPad Pro 12.9″ 3rd generation.

Country of manufacture — China. Condition — new. SKU — 101051.